Semiconductors - Letters of Intent/Agreements

The U.S. semiconductor industry, represented by the members of the Environmental Protection Agency's PFC Reduction/Climate Partnership for the Semiconductor Industry, has committed to reduce absolute perfluorocompound (PFC) emissions by 10% below the 1995 baseline level by the year 2010. Perfluorocompounds include the most potent and long-lived greenhouse gases such as perfluorocarbons (e.g., CF4, C2F6, C3F8), trifluoromethane (CHF3), nitrogen trifluoride (NF3), and sulfur hexafluoride (SF6).

The Environmental Protection Agency's (EPA) voluntary semiconductor industry partnership was developed collaboratively with the Semiconductor Industry Association (SIA). EPA, SIA, and the Partner companies (listed below) are working to reduce industry greenhouse gas (GHG) emissions. EPA's domestic partnership has grown to a worldwide voluntary climate protection partnership through the World Semiconductor Council (WSC), representing today the semiconductor industries of the U.S., Japan, Europe, Korea, Taiwan and China. In 2000, the WSC voluntarily committed to reducing its PFC emissions by 10% below baseline emissions by 2010, representing the first global sector-wide climate protection goal. In recognition of this unprecedented global industry commitment to climate protection, EPA awarded the WSC one of its first annual Climate Protection Awards.

Read the Memorandum of Understanding between the Semiconductor Industry Association and the Environmental Protection Agency (PDF 1.9 MB)
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EPA's Semiconductor Industry PFC Reduction / Climate Partners
Advanced Micro Devices
Eastman Kodak Company
Fairchild Semiconductor Corporation
Freescale Semiconductor
Hewlett Packard
Hynix Semiconductor Manufacturing, Inc.
IBM Microelectronics Division
Intel Corporation
Intersil Corporation
LSI Logic
Micron Technology, Inc.
National Security Agency (NSA)
National Semiconductor Corporation
NEC Microelectronics, Inc.
ON Semiconductor
Philips Semiconductors, Inc.
ST Microelectronics
Texas Instruments


Page Last Modified:   August 7, 2008